Samsung looks like it might be lining up its ducks for a really serious assault on the global mobile handset market. The company hasn’t been to only develop what are reported to be some very nice new handsets, on show at the 2005 CES.

Today the company announced the release of what it says is the first eight-die multi-chip package (MCP) for mobile phones.

 

MCPs are all about packaging a device's functionality into the smallest physical space, and so are massively important for mobile phone designers; consumers are quite rightly demanding that form-factors on advanced phones shrink.  The new Samsung MCP is 1.4mm thick.